Thermal Management of Microelectronic Equipment : Heat Transfer Theory, Analysis Methods, and Design Practices
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.
The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. The authors are recognized experts in the field of thermal management of electronic systems and have a combined 80-plus years of experience in the defense and commercial industries.
- Hardback | 500 pages
- 152 x 229 x 28.7mm | 866.36g
- 30 Jul 2016
- American Society of Mechanical Engineers,U.S.
- Fairfield, United States
- 2nd Revised edition
Other books in this series
30 Jul 2016
28 Feb 2014