Substrate Surface Preparation

Substrate Surface Preparation

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Description

"Substrate Surface Preparation" serves as a practical, one-stop reference covering the technologies developed to produce flat surfaces with nanometer accuracy for the subsequent building of semiconductor devices and integrated circuits. This hands-on resource offers engineers detailed guidance in the entire substrate surface preparation process, from lapping and polishing...to specialized techniques and surface finishing. Supported with over 125 illustrations, this unique book provides a complete understanding of important maintenance methods and the full range of equipment available in the field. Practitioners gain the know-how and confidence they need to produce desired results when processing a sample of new material, rather than wasting time and money on a trial and error approach. Moreover, this authoritative book presents in-depth discussions on key applications, such as optics production and semiconductor de-lamination and deconstruction.
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Product details

  • Hardback | 200 pages
  • 157 x 234 x 15mm | 386g
  • Norwood, United States
  • English
  • 1608072134
  • 9781608072132

Table of contents

Introduction. Preparation: Before the Start. Lapping. Polishing. Specific Processes and Materials. Specialized Techniques. Surface Finish. Optics. Semiconductor Device Deconstruction. Metallurgical Processing and Microscopy. Setting Up a Laboratory. Using Interferometry. Appendix: The Workshop Grazing Incidence Interferometer.
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About Max Robertson

Max Robertson has decades of industry experience and was most recently a development manager in company manufacturing the type equipment that is described in this book. He holds a B.Sc. in engineering from St. Andrews University.
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