Statistics in Industry

Statistics in Industry

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Engineers, technicians and managers involved in the characterization and optimization of semiconductor processes and equipment should be aided by this broad selection of 32 case studies that illustrate how SEMATECH and its sponsoring members have benefitted from the use of statistical methods.
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Product details

  • Hardback | 330 pages
  • 220 x 280mm | 333g
  • London, United Kingdom
  • 0412997010
  • 9780412997013

Table of contents

Laminated qualification plan card; Facts about Sematech. Statistical methods used in the Sematech qualifications plan, Veronica A. Czitrom and Karen Horrell. Gauge studies: Introduction to gauge studies; Prometrix RS35E gauge study in five two-level factors and one three-level factor, James Buckner, Barry Chin and Jon Henri; A comparison study of five defect detection metrology systems; Karen Gildersleeve and Pat Gabella; Calibration of an FTIR spectrometer for measuring carbon, Peter C. Pankratz; Revelation of a microbalance warm-up effect, James Buckner, Barry L. Chin, Todd Green and Jon Henri; GRR methodology for destructive testing and quantitative assessment of gauge capability for one-side specifications, Teresa Mitchell, Victor Hegemann and K.C. Liu. Passive data collection: Introduction to passive data collection; Understanding the nature of variability in a dry etch process, Richard O. Lynch and Richard J. Markle; Virgin versus recycled wafers for furnace qualification - is the expense justified?, Veronica A. Czitrom and Jack E. Reece; Identifying sources of variation in a wafer planarization process, Arnon Hurwitz and Patrick Spagon; Factors which affect the number of aerosol particles released by cleanroom operators, William Kahn and Carole Backowski; A skip-lot sampling plan based on variance components for photolithographic registration measurements, Dwayne Pepper; Sampling to meet a variance specification; cleanroom qualification, Diane Lambert, James M. Landwehr and Ming-Jen Shyu. Design of experiments: Introduction to design of experiments; Elimination of TiN peeling during exposure to CVD tungsten deposition process using designed experiments, James Buckner, David J. Cammenga and Ann Weber; Characterization of the lithographic process window using response surface modelling, Patrick G. Drennan; Modelling a uniformity bulls-eye inversion, James Buckneret al; Using fewer wafers to resolve confounding in screening experiments, Joel Barnett et al; Planarization by chemical polishing - a rate and uniformity study, Anne E. Freeny and Warren Y-C Lai; Use of experimental design to optimize a process for etching polycrystalline silicon gates, Fred Preuninger et al; Optimization of wafer stepper alignment using robust design, Brenda Cantell, Jose Ramirez and William Gadson; Single step poly tech process optimization, Rami Duek, Yehuda and Oren Bar-Ilan; A demonstration of the power of evolutionary operations in optimizing a new wavesolder process, Steve Zinkgraf et al; Application of semi-empirical model building to the RTCVD of polysilicon, Joseph C. Davis et al.
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