Semiconductor Manufacturing Technology

Semiconductor Manufacturing Technology

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For the introductory course in Semiconductor Manufacturing Technology.

This text introduces the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra-large-scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications.
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Product details

  • Hardback | 666 pages
  • 212 x 278 x 30mm | 1,660.17g
  • Pearson
  • Upper Saddle River, NJ, United States
  • English
  • 0130815209
  • 9780130815200
  • 2,147,680

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This book is written for students in two- and four-year technology programs at community colleges and universities. Chapters are organized around the broad technologies applicable to semiconductor manufacturing. Chapters 1 to 8 present fundamental technical information relevant to semiconductor manufacturing. Chapter 9 presents a process model overview with a general flowchart that links the major areas in wafer fabrication. Chapters 10 to 19 cover each of the major processes. Each process chapter concludes with a summary of quality measures and troubleshooting issues to provide the student with practical challenges encountered during wafer fabrication. Chapter 20 provides an overview of the back-end process for IC assembly and packaging. Academic and industry reviewers have applauded this book as the most comprehensive and up-to-date text currently available in the market.
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Table of contents

1. Introduction to the Semiconductor Industry.

2. Characteristics of Semiconductor Materials.

3. Device Technologies.

4. Silicon and Wafer Preparation.

5. Chemicals in Semiconductor Fabrication.

6. Contamination Controls in Wafer Fabs.

7. Metrology and Defect Inspection.

8. Gas Control in Process Chambers.

9. IC Fabrication Process Overview.

10. Oxidation.

11. Deposition.

12. Metallization.

13. Photolithography: Vapor Prime to Soft Bake.

14. Photolithography: Alignment and Exposure.

15. Photolithography: Photoresist Development and Advanced Lithography.

16. Etch.

17. Ion Implant.

18. Chemical Mechanical Planarization.

19. Wafer Test.

20. Assembly and Packaging.



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