Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections - 1999

Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections - 1999

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Description

Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
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