Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections - 1999
Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
- Paperback | 171 pages
- 15 Oct 1999
- American Society of Mechanical Engineers,U.S.
- Fairfield, United States