Reliability and Failure of Electronic Materials and Devices, Second Edition
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
- Paperback | 758 pages
- 158 x 238 x 46mm | 1,179.98g
- 01 Dec 2014
- Elsevier Science Publishing Co Inc
- Academic Press Inc
- San Diego, United States
- 2nd edition
- colour illustrations
Table of contents
CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues
About Milton Ohring
Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise. In 1988, Dr Lucian Kasprzak became an IEEE Fellow "For contributions to very-largescale-integrated devices through the integration of reliability physics with process development." He discovered the hot-electron effect in short channel field-effect transistors, while at IBM in 1973. From 1992 to 1996, he was Associate Professor of Physics and Engineering Science at Franciscan University. He retired from IBM in 1995 after 30 years. In 1996, he joined Sterling Diagnostic Imaging as Reliability Manager for the Direct Radiography Program. He became Director of Reliability at Direct Radiography Corp. in 1997. Early in 2001 he became an independent Reliability Consultant.