Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (Hdp '06)

Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (Hdp '06) : June 27th-June 30 2006: Shanghai University, Shanghai, China

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Product details

  • CD-Audio
  • United States
  • 1424404894
  • 9781424404896