Polymers for Electronic and Photonic Applications
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This book provides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging, electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacture microelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments in this field.
- Hardback | 661 pages
- 157.7 x 235.2 x 34.3mm | 1,079.89g
- 01 Jan 1993
- Elsevier Science Publishing Co Inc
- Academic Press Inc
- San Diego, United States
- references, index
Table of contents
Overview of Polymers for Elecrtronic and Photonic Applications. The Chemistry of Polymers for Microlithographic Applications. Interconnect Dielectrics. Recent Advances in IC Passivation and Encapsulation: Process Technqieus and Materials. Polyimides for Electrronic Applications. Polyimidesiloxanes: Chemistries and Applications. Applications of Epoxy Resins in Electronics. Advances in Thermoplastics for Electronic Applications. Polymers for Increased Circuit Density in Interconnection Technology. Piezoelectric and Pyroelectric Polymers. Polymers for Non-linear Optics. Polymers as Third-Order Nonlinear Optical Materials. Polymers for Integrated Optical Waveguides. Langmuir-Blodgett Manipulation of Electrically Responsive Polymers. Basic Concepts of Polymer Mechanical Behavior. Chapter Refernces. Index.