Preface. Reliability Effects for MCM and Sensors. Thermal Investigations of Microsystems; V. Szekely, M. Rencz. Failure Analysis of Migrated Short Circuits in MCMs Using Soldering; G. Harsanyi, L. Percsi. Internal Liquid Cooling of Integrated Circuits and Multichip Modules; G. van Alme, et al. Holographic and Thermal Diagnostics of Integrated Circuits; P.J. Mach. Accelerated Life Tests of Ultrasonic Wire Bonds; J. Urbancik, N. Urbancikova. Methods of Improving Radiation Resistance of Hybrid Integral Circuits Elements; E.A. Tchornyj, R.B. Bedriy. Wire Bonding to Multichip Modules and Other Soft Substrates; G.G. Harman. MCM-C MCMs for Computers and Telecom in CHIPPAC Programme; J. Joly, et al. Buried Passive Component Realisation in Low Temperature Cofired Ceramic for MCM-C Substrate Applications; R. Doyle, et al. A Novel Transcutaneous Blood Oxygen Sensor Based on MCM-C Technology; G. Harsanyi, et al. Advanced Thick Film Techniques for Multilayer Structures and Sensors; S.I. Leppavuori, A.K. Uusimaki. MCM-D/L Some Investigations on Wiring in New Generation Multichip Modules Applied in High Speed Large Scale Integrated Telecommunication Units; P. Philippov, et al. Some Chapters from the COB Technology; B. Roesner. Thin Film Multichip Modules Based on Photosensitive Benzocyclobutene; G. Chmiel, H. Reichl. Sensors. Thin Film Thermal Microsensors; S.J. Osadnik, et al. Electrical Properties of Thick Film PTC Compositions; J. Hormadaly, et al. Current Research on Thin and Thick Film Sensors at the Department of Electronics, University of Mining and Metallurgy in Krakow; T. Pisarkiewicz, A. Kolodziej. Materials and Devices for Fiber Optic Sensors; A. Kikineshy, et al.Integration Techniques for Smart Sensors; R. Dell'Acqua. Micro- Machined Accelerometers for MCM Integration; C.E. Bauer. Research into Novel Sensors on Silicon Substrates; M. Mullins, et al. System Requirements and Integration. From Multichip Modules (MCMs) to Micro System Modules (MSMs); G. Nicolas. Prototyping of Multichip Modules Theory, Services, and Assessment; J. Dillion. BARMINT Project for Promoting Standards in Microsystem Integration; D. Esteve. A Hybrid Integrated Gassensor on Silicon; A. Van Calster, K. Sabbe. ISHM-Hungary Poster Papers. Investigation of Ultraviolet Laser Induced Conductive Layer of Silver Salt Filled Polyimide Films; Z. Kocsis, et al. 57Fe and 57Co Moessbauer Study of Suppression of Superconductivity in PrBa2Cu3O7-d; E. Kuzmann, et al. Plastic PGA-64 Packages; G. Ripka, I. Hajdu. Analysis of Laser Induced Surface Effects on AlN Substrates; Z. Illyefalvi-Vitez, et al. Structural and Electrical Characterisation of AIGeNi/n-GaAs Contacts; B. Kovacs, et al. Buried Vias in Multilayer Printed Wiring Boards; L. Gal, et al. Surface Pattern Formation and the Volatile Component Loss of Heat Treated Pd/InP and Au/InP Samples; I. Mojzes, et al. Polymer Thick-Film Pressure Sensor; C. Csaszar. Author Index. Keyword Index.