Manufacturing Processes and Materials Challenges in Microelectronic Packaging

Manufacturing Processes and Materials Challenges in Microelectronic Packaging : Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

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Product details

  • Book | 153 pages
  • 222.25 x 285.75 x 12.7mm | 385.55g
  • United States
  • English
  • 0791808963
  • 9780791808962