Ionized Physical Vapor Deposition: Volume 27
For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools.
Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference.
The first comprehensive volume on ionized physical vapor deposition
Combines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVD
Emphasizes practical applications in the area of IC fabrication and interconnect technology
Serves as a guide to select the most appropriate technology for any deposition application
- Hardback | 255 pages
- 152.4 x 228.6 x 22.9mm | 521.64g
- 14 Oct 1999
- Elsevier Science Publishing Co Inc
- Academic Press Inc
- San Diego, United States
Other books in this series
23 Oct 1998
12 Aug 1998