Integration of Passive RF Front End Components in SoCs

Integration of Passive RF Front End Components in SoCs

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Description

Examining the most important developments in highly integrated wireless RF front ends, this book describes and evaluates both active and passive solutions for on-chip high-Q filtering, and explores M-phase filters in depth. An accessible step-by-step approach is used to introduce everything an RF designer needs to know about these filters, including their various forms, principles of operation, and their performance against implementation-related imperfections. Real-world examples are described in depth, and detailed mathematical analyses demonstrate the practical quantification of pertinent circuit parameters.show more

Product details

  • Electronic book text
  • CAMBRIDGE UNIVERSITY PRESS
  • Cambridge University Press (Virtual Publishing)
  • Cambridge, United Kingdom
  • 110 b/w illus. 3 tables
  • 1139030728
  • 9781139030724

Table of contents

1. Introduction to highly integrated and tunable RF receiver front ends: 1.1. Introduction; 1.2. Front-end integration challenges and system requirements; 1.3. 2G receiver SAW elimination; 1.4. 3G receiver SAW elimination; 1.5. Summary and conclusions; 2. Active blocker-cancellation techniques in receivers: 2.1. Introduction; 2.2. Concept of receiver translational loop; 2.3. Nonideal effects; 2.4. Circuit implementations; 2.5. Measurement results; 2.6. Feedback blocker-cancellation techniques; 2.7. Summary and conclusions; 3. Impedance transformation: Introduction to the simplest on-chip SAW filter; 3.1. Introduction; 3.2. Impedance transformation by a 50% passive mixer; 3.3. Application as on-chip SAW filter; 3.4. Impact of harmonics on the sharpness of the proposed filter; 3.5. Differential implementation; 3.6. Summary and conclusions; 4. Four-phase high-Q bandpass filters: 4.1. Introduction; 4.2. Impedance transformation by a four-phase filter; 4.3. Differential implementation of four-phase high-Q bandpass filter; 4.4. Application as an on-chip SAW filter; 4.5. Impact of harmonics on the sharpness of the proposed filter; 4.6. Four-phase high-Q bandpass filter with a complex baseband impedance; 4.7. Four-phase high-Q bandpass filter with quadrature RF inputs; 4.8. Harmonic upconversion and downconversion; 4.9. A SAW-less receiver with on-chip four-phase high-Q bandpass filters; 4.10. Summary and conclusions; 5. M-phase high-Q bandpass filters: 5.1. Introduction; 5.2. Impedance transformation by M-phase filters; 5.3. Differential implementation of M-phase high-Q filter; 5.4. Application as an on-chip SAW filter; 5.5. Impact of harmonics on the sharpness of the M-phase bandpass filter; 5.6. M-phase high-Q filter with complex baseband impedances; 5.7. M-phase high-Q bandpass filter with quadrature RF inputs; 5.8. M-phase high-Q bandpass filter with N-phase complex bandpass filters; 5.9. Harmonic upconversion; 5.10. Summary and conclusions; 6. Design of a superheterodyne receiver using M-phase filters: 6.1. Introduction; 6.2. Proposed superheterodyne receiver architecture; 6.3. Design and implementation of the receiver chain; 6.4. Measurement results; 6.5. Summary and conclusions; 7. Impact of imperfections on the performance of M-phase filters: 7.1. Introduction; 7.2. Mathematical background; 7.3. LO phase noise; 7.4. Second-order nonlinearity in the switches of the bandpass filter; 7.5. Quadrature error in the original 50% duty-cycle clock phases; 7.6. Harmonic downconversion; 7.7. Thermal noise of switches; 7.8. Parasitic capacitors of switches; 7.9. Switch charge injection; 7.10. Mismatches; 7.11. Summary and conclusions; 8. M-phase filtering and duality: 8.1. Introduction; 8.2. Dual of an electrical circuit; 8.3. Dual of M-phase filter; 8.4. Dual of M-phase high-Q filter with complex baseband impedances; 8.5. Summary and conclusions; Appendix; References; Index.show more