ISTFA 2003 : Book and CD-ROM Set
This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis. The CD-ROM presents the complete content of the book in fully searchable Adobe Acrobat PDF format. Contents: Fault Isolation of the Electrical Fail over Sample Presentation; Imaging and Material Analysis; Failure Analysis Process Flows on Individual Components; System-Level Performance; Manufacturing yield Enhancements; Packaging Issues and Solutions; Hot Topics such as Optical Probing and Tester-Driven Failure Analysis.
- Mixed media product | 700 pages
- 210.8 x 271.8 x 30.5mm | 1,247.39g
- 01 Oct 2003
- ASM International
- Ohio, United States