ISTFA 2001 : International Symposium for Testing and Failure Analysis
Proceedings of the 27th International Symposium for Testing and Failure Analysis, 11-15 November 2001, Santa Clara, California. This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis. The CD-ROM provides the complete content of the book in searchable Adobe Acrobat PDF format. Contents include: Advanced techniques Packaging Backside analysis Scanning probe microscopy Focused ion beam (FIB) techniques Failure analysis of micro-electromechanical systems (MEMS) Yield improvement Discretes Defect-based testing Case histories.
- Mixed media product | 550 pages
- 210.82 x 271.78 x 25.4mm | 1,247.37g
- 01 Dec 2001
- ASM International
- Ohio, United States