ISTFA 2000: 26th International Symposium for Testing and Failure Analysis (Book and CD Rom) : 26th International Symposium for Testing and Failure Analysis
Proceedings of the 2000 International Symposium for Testing and Failure Analysis, held 12th-16th November, 2000, at Meydenbauer Convention Center, Belvue, Washington. These proceedings present in-depth coverage of the latest developments and the most advanced techniques for testing and failure analysis of microelectronic components. The book covers the full spectrum of failure analysis topics, but with special emphasis on backside (flipchip) failure analysis and the diagnosis of high-end microchip failures, by analyzing the silicon. Contents: Advanced Techniques; Packaging; Testing and Yield Enhancement; Backside Analysis; New Techniques; Case Histories; Focused Ion Beam Analysis; Scanning Probe Microscopy Analysis. The CD-ROMAs PDF-file format can be accessed using Adobe Acrobat Reader 4.0 or higher.
- 215.9 x 230 x 31.75mm | 1,478.71g
- 01 Dec 2000
- ASM International
- Ohio, United States