Handbook of Digital Techniques for High-Speed Design

Handbook of Digital Techniques for High-Speed Design : Design Examples, Signaling and Memory Technologies, Fiber Optics, Modeling, and Simulation to Ensure Signal In

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This practical handbook fills in gaps that other textbooks on high-speed design don't discuss, covering every aspect of high-speed board-level digital design. Several design examples at high Gigabit per second data rates are presented. Discusses highest-speed logic and interface families of devices, relevant applications, and device speeds versus how far signals transmit with good signal integrity. A quick-reference overview of each device family is also provided. High-speed design rules are presented for both engineering design and printed circuit board layout. Emphasizes designing high-speed backplanes, driving cabling, bus architecture and topology. Discusses IBIS and SPICE modeling, simulations, design processes, and over 30 design automation tools. Quantifies signal integrity using jitter and bit error rate measurements, eye diagrams, time-domain reflectometry and transmission. Details high-speed transmission line and parasitic effects, cabling, connectors, single-ended/differential terminations, lab test equipment, and intellectual property. Dedicated chapter on fiber optics and when to use.
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Product details

  • Hardback | 976 pages
  • 184 x 242 x 40mm | 1,656g
  • Prentice Hall
  • Upper Saddle River, United States
  • English
  • 013142291X
  • 9780131422919
  • 2,258,569

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Circuits, Devices andSystems Digital Techniques for High-SpeedDesignTOM GRANBERGHigh-speed digitaldesign--Complete, current, and practicalPracticing engineers whowork with high-speed digital designknow that a thorough, fully up-to-date resource is crucial for keeping pacewith rapidly changing technologies. Senior and graduate-level engineeringstudents need a similar resource, but with added introductory material andplenty of exercises. Only one book fills the need of both audiences--Handbookof Digital Techniques for High-Speed Design, by electronics expert TomGranberg.This practical handbookcovers every aspect of board-level design, starting with the basics of designtrends, SerDes and bus technologies, and signal integrity. In-depth topics includememory technologies, fiber optics, modeling and simulation, design tools andthe design process, CML controlled-impedance drivers, differential andmixed-mode S-parameters, and the emerging protocols and technologies of RapidIOand PCI-Express. Tom Granberg also features major, detailed high-speed designexamples--including a BLVDS SerDes design and a design with highgigabit-per-second serial links using WarpLink devices.This bookProvides detailed technical information on CML, SSTL, GTL/GTL+/GTLP, LVDS, Bus LVDS, M-LVDS, LVDM, ECL, PECL, LVPECL, HSTL, and more--plus applications best suited for eachDiscusses IBIS and SPICE modeling and simulation, plus a full range of electronic design automation (EDA) toolsEmphasizes backplane and bus design with detailed guidelines and design rulesCovers fiber optics in detail--and when it makes sense to use them, and much more!This book was written withtwo audiences in mind--practicing engineers who work with high-speeddigital electronics, and graduate and undergraduate-level students in collegesand universities who need to learn the concepts and techniques of high-speeddigital design before going to work in industry.
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Table of contents

Preface.

I. INTRODUCTION.

1. Trends in High-Speed Design.




2. ASICs, Backplane Configurations, and SerDes Technology.




3. A Few Basics on Signal Integrity.


II. SIGNALING TECHNOLOGIES AND DEVICES.

4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
5. Low Voltage Differential Signaling (LVDS).
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
9. Current-Mode Logic (CML).
10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices.
11. Fiber-Optic Components.
12. High-Speed Interconnects and Cabling.
III. HIGH-SPEED MEMORY AND MEMORY INTERFACES.

13. Memory Device Overview and Memory Signaling Technologies.
14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation.
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
16. Quad Data Rate (QDR, QDRII) SRAM.
17. Direct Rambus DRAM (DRDRAM).
18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.
IV. MODELING, SIMULATION, AND EDA TOOLS.

19. Differential and Mixed-Mode SParameters.
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs.
21. Modeling with IBIS.
22. Mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.
V. DESIGN CONCEPTS AND EXAMPLES.

23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects.
Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters.
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
25. Designing with LVDS.
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
27. WarpLink SerDes System Design Example.
VI. EMERGING PROTOCOLS AND TECHNOLOGIES.

28. Electrical Optical Circuit Board (EOCB).
29. RapidIO.
30. PCI Express and ExpressCard.
VII. LAB AND TEST INSTRUMENTATION.

31. Electrical and Optical Test Equipment.
Acronyms.
References.
About the Author.
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About Tom Granberg

TOM GRANBERG has earned several technical degrees-a B.S. in Physics from Washington State University and an M.S. and Ph.D. in Electrical Engineering from the University of Missouri-Columbia. He also holds an M.B.A. from the University of Colorado at Denver. Tom has worked for dominant networking companies Cisco Systems and SkyStream Networks and in ASIC design emulation at Quickturn Design Systems (a Cadence Company). He has also worked in digital signal processing, digital imaging systems, and flat panel sensors, and at companies including Condor Systems, Martin Marietta (now Lockheed Martin), Storage Technology, and Honeywell Test Instruments. He lives in Santa Clara, California-the heart of the Silicon Valley-and enjoys access to many of the world 's newest technologies.
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