Electronic Physical Design
For courses such as Electronic Manufacturing Processes, Electronic Physical Design, Circuit Board Design, and Electronic Prototyping. Useful as a reference for both the theory and practice of electronic physical design. This text addresses the choices to be made at the IC level, the IC package level, and the circuit board level. It then discusses the choices between the many types of resistors, capacitors, connectors, and transistor packages. Finally, this text addresses the concepts involved in building high-quality products, such as robust design, heat vibration, shock, dust, and humidity.
- Hardback | 368 pages
- 187.96 x 231.14 x 25.4mm | 657.71g
- 16 Feb 2003
- Pearson Education (US)
- Upper Saddle River, NJ, United States
- glossary, index
Back cover copy
ELECTRONIC PHYSICAL DESIGN is an excellent text for readers learning how to improve the physical design of products. The focus of the book is on how to take a circuit, which has been successfully simulated, from the design stage to the production stage. The book uses a unique approach, by using an example of each physical design consideration and applying it to the design of a "boom box: " a portable, personal stereo system complete with radio, tape player, CD player, and speakers. In this way, readers can readily grasp the concepts and understand how they apply to the specific circuit being presented. The book covers the fundamentals as well as more advanced topics: a brief introduction of electronicssafety issuesmany types of electronic componentsfixed and variable resistorscapacitor typesdiode and transistor packagesthe process by which circuits are builthow to make a high-quality productwise physical design decision makinghow vibration, shock, humidity, and dust affect design
Table of contents
SECTION I. SETTING THE STAGE. Introduction. 1. Design Decisions and Documentation. SECTION II. ELECTRONIC COMPONENTS. 2. Electronic Components and Packaging Levels. 3. Fixed and Variable Resistors. 4. Fixed and Variable Capacitors. 5. Discrete Transistors and Diodes; Connectors. SECTION III. HOW INTEGRATED CIRCUITS ARE MADE. 6. History, Substrates and Patterning. 7. Adding Materials. 8. Removing Materials; Future Devices. SECTION IV. ELECTRONIC MANUFACTORING PROCESSES AND MATERIALS. 9. Integrated Circuit Packages: Process and Materials. 10. Hybrids, MCMs, and PWBs. 11. PWB Assemblies (Level 2) 12. Motherboards and Backplanes. SECTION V. PHYSICAL DESIGN ISSUES. 13. Reliability. 14. Thermal Design Considerations. 15. Temperature Difference Considerations. 16. Designing for Vibration and Shock. 17. Dealing with Humidity. 18. Dealing with Dust. 19. Miscellaneous Considerations and Conclusion. Glossary. Index.