Digital Signal Integrity

Digital Signal Integrity : Modeling and Simulation with Interconnects and Packages

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For advanced courses in digital design.This state-of-the-art book provides students with techniques for predicting and achieving target performance levels. Gives students all the theory, practice, general signal integrity issues, and leading-edge experimental techniques they need to accurately model and simulate those interconnections and predict real-world more

Product details

  • Hardback | 560 pages
  • 177.8 x 238.76 x 35.56mm | 907.18g
  • Pearson Education (US)
  • Prentice Hall
  • Upper Saddle River, United States
  • English
  • 0130289043
  • 9780130289049

Back cover copy

State-of-the-art techniques for predicting and achieving target performance levels Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues Multiconductor interconnects: packages, sockets, connectors and buses Modal decomposition: understanding the outputs generated by commercial modeling software Layer peeling with time-domain reflectometry: its power and limitations Experimental techniques for characterizing interconnect parasitics In "Digital Signal Integrity," Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you more

About Brian Young

BRIAN YOUNG is a Member of the Technical Staff at the Somerset Design Center, Semiconductor Product Sector, Motorola, working on packaging, interconnects, and I/O design for PowerPC microprocessors and the RapidIO Interconnect Architecture. For over seven years he has specialized in simulation, modeling, measurement, and performance studies for high-speed signaling with microprocessors, fast static RAMs, and DSPs. He has served as an Assistant Professor in the Department of Electrical Engineering at Texas A&M University, College Station, and as an adjunct professor in the Department of Electrical Engineering at the University of Texas, Austin. Dr. Young holds a Ph.D from the University of Texas, Austin and holds six patents related to packaging. He has published numerous articles in conferences and more

Table of contents

1. Digital Systems and Signaling. Tradeoffs for Performance Enhancement. Signaling Standards and Logic Families. Interconnects. Modeling of Digital Systems.2. Signal Integrity. Transmission Lines. Ideal Point-to-Point Signaling. Nonideal Signaling. Discontinuities. Crosstalk. Topology. Simultaneous Switching Noise. System Timing. Exercises.3. Simultaneous Switching Noise. Origins of SSN. Effective Inductance. Off-Chip SSN Dependencies. SSN-Induced Skew. Fast Simulation of Banks. Exercises.4. Multiport Circuits. Z-and Y-Parameters. S-Parameters. Multiport Conversions Between S-, Y-, and Z-Parameters. Normalization of S-Parameters. Matrix Reductions. Exercises.5. Inductance. Summary of an Electromagnetic Result. Definitions of Inductance. Definition of Mutual Inductance. Calculations with Neumann's Formula. Definition of Partial Inductance. Formulas for Partial Self- and Mutual Inductance. Circuit Symbols. Modal Decomposition. Nonuniqueness of Partial Inductance. Open Loop Modeling. Manipulating the Reference Lead. Model Reduction. Exercises.6. Capacitance. Definition of Capacitance. Capacitance between Several Conductors. Energy Definition of Capacitance. Frequency Dependence. Circuit Equations with Capacitance. Modal Decomposition and Passivity. Reference and Capacitance. Model Reduction. Exercises.7. Resistance. Skin Effect. Current Crowding. PEEC Method. Ladder Networks. Transresistance. Exercises.8. Measurement of Parasitics. Measurement Counts. Impedance Analyzer. Vector Network Analyzer. Time-Domain Reflectometer. Tradeoffs. Exercises.9. Lumped Modeling. Transmission Line Introduction. Multiconductor Modeling with Two Samples. Multiconductor Modeling with One Sample. Internal Nodes. Frequency Dependence. Iterative Impedance and Bandwidth. Model Reduction. Approaches for Specific Interconnects. General Topology. Multidrop Nets. Exercises.10. Wideband Modeling. Transmission Line Lumped Modeling. Coupled Transmission Lines. Skin Effect Models. Black Box Modeling. Exercises.11. Enhancing Signal Integrity. Differential Signaling. Termination. Multiconductor Termination. Power Distribution. Advanced Packaging. Exercises.Appendix A: Solutions to Selected Problems. Appendix B: Coaxial Peec Calculator. Appendix C: Sample Spice SSN Simulations. Appendix D: Sample Modal Decomposition Code. Appendix E: Sample Layer Peeling Code. Index. About the more

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