Application of Fracture Mechanics in Electronic Packaging: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997

Application of Fracture Mechanics in Electronic Packaging: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997

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Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.
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