Application of Fracture Mechanics in Electronic Packaging: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997
Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.
- Hardback | 200 pages
- 15 Nov 1997
- American Society of Mechanical Engineers,U.S.
- Fairfield, United States