Advances in Electronic Circuit Packaging
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Advances in Electronic Circuit Packaging : Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

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Product details

  • Paperback | 328 pages
  • 178.05 x 254 x 20.07mm | 662.24g
  • Springer-Verlag New York Inc.
  • New York, United States
  • English
  • Softcover reprint of the original 1st ed. 1962
  • 176 Illustrations, black and white; XV, 328 p. 176 illus.
  • 1489972978
  • 9781489972972