Advances in Thermal Modelling of Electronic Components and Systems v. 3

Advances in Thermal Modelling of Electronic Components and Systems v. 3

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Description

This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov
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Product details

  • Paperback | 459 pages
  • 157.5 x 236.2 x 30.5mm | 771.12g
  • Fairfield, United States
  • English
  • 0791800652
  • 9780791800652