Advances in Thermal Modelling of Electronic Components and Systems: v. 3

Advances in Thermal Modelling of Electronic Components and Systems: v. 3

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Description

This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.
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Product details

  • Hardback | 402 pages
  • 185.42 x 254 x 35.56mm | 703.06g
  • Fairfield, United States
  • English
  • 0791800180
  • 9780791800188