Advances in Research and Development

Advances in Research and Development : Modeling of Film Deposition for Microelectronic Applications

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Description

Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 22 volumes since 1963. The series contains quality studies of the properties of various thin filmsmaterials and systems. In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.
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Product details

  • Hardback | 290 pages
  • 242 x 312 x 108mm | 979.77g
  • Academic Press Inc
  • San Diego, United States
  • English
  • b&w illustrations, colour illustrations, references, indexes
  • 0125330227
  • 9780125330220

Table of contents

M.J. Brett, S.K. Dew, and T.J. Smy, Thin Film Microstructure and Process Simulation Using SIMBAD. S. Hamaguchi, Mathematical Methods for Thin Films Deposition Simulations. C.-C. Fang, V. Prasad, R.V. Joshi, F. Jones, and J.J. Hsieh, A Process Model for Sputter-Deposition of Thin Films Using Molecular Dynamics. T.S. Cale and V. Mahadev, Feature Scale Transport and Reaction during Low Pressure. Chapter References. Author Index. Subject Index.
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