ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

  • Paperback
By (author) 

List price: US$210.01

Currently unavailable

We can notify you when this item is back in stock

Add to wishlist

AbeBooks may have this title (opens in new window).

Try AbeBooks

Description

Print proceedings of the ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2015): Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Printed collection on 83 full-length, peer-reviewed technical papers. Topics include:

Advanced Electronics and Photonics, Packaging Materials and Processing
Advanced Electronics and Photonics: Packaging, Interconnect and Reliability
Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
show more

Product details