2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1

2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1

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Description

Focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies.

Printed collection on 86 full-length, peer-reviewed technical papers. Topics include:

Advanced Packaging
Emerging Technologies
Modeling and Simulation
Multi-Physics Based Reliability
MEMS and NEMS
Materials and Processes
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