• Progress in Compound Semiconductor Materials IV - Electronic and Optoelectronic Applications: Volume 829 See large image

    Progress in Compound Semiconductor Materials IV - Electronic and Optoelectronic Applications: Volume 829 (Mrs Proceedings) (Hardback) Edited by Robert M. Biefeld, Edited by G. J. Brown, Edited by Claire F. Gmachl, Edited by M. O. Manasreh, Edited by K. Unterrainer

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    DescriptionCentral to bandgap engineering, or more precisely, 'wave-function engineering,' is the concept that, by spatially varying the composition and doping of semiconductors over distances ranging from a few micrometers down to one monolayer, one can tailor the electronic band structure in a nearly arbitrary and continuous way using epitaxial growth techniques. The objective of this book is to review the progress on interband and intersubband transitions in semiconductors including III-V, IV and II-VI materials and quantum structures, as well as to cover the progress on light sources, detectors, modulators and electronic materials and devices. This book brings together internationally recognized researchers to report on their most recent results and newly gained insights and to provide an up-to-date snapshot of optoelectronics and related fields in 2004/2005. The book covers a wide range of topics spanning opto- and microelectronic materials, growth and synthesis, devices, experimental techniques, modeling tools, and applications. Wavelength ranges span from the UV to the THz, and into the GHz modulation range.


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  • Full bibliographic data for Progress in Compound Semiconductor Materials IV - Electronic and Optoelectronic Applications: Volume 829

    Title
    Progress in Compound Semiconductor Materials IV - Electronic and Optoelectronic Applications: Volume 829
    Authors and contributors
    Edited by Robert M. Biefeld, Edited by G. J. Brown, Edited by Claire F. Gmachl, Edited by M. O. Manasreh, Edited by K. Unterrainer
    Physical properties
    Format: Hardback
    Number of pages: 560
    Width: 152 mm
    Height: 228 mm
    Thickness: 30 mm
    Weight: 910 g
    Language
    English
    ISBN
    ISBN 13: 9781558997776
    ISBN 10: 1558997776
    Classifications

    DC21: 621.38152
    B&T Book Type: NF
    BIC E4L: TEC
    B&T Modifier: Region of Publication: 01
    Nielsen BookScan Product Class 3: S9.9T
    B&T General Subject: 710
    Ingram Subject Code: TE
    B&T Modifier: Academic Level: 03
    BISAC V2.8: TEC021000
    BIC subject category V2: TGM
    BISAC V2.8: TEC008090
    DC22: 621.38152
    BIC subject category V2: TJFD5
    Libri: I-TE
    Warengruppen-Systematik des deutschen Buchhandels: 16460
    LC subject heading:
    B&T Merchandise Category: UP
    LC classification: TA
    B&T Modifier: Text Format: 05
    Abridged Dewey: 620
    LC subject heading:
    Thema V1.0: TJFD, TGM
    Illustrations note
    black & white illustrations
    Publisher
    Materials Research Society
    Imprint name
    Materials Research Society
    Publication date
    13 April 2005
    Publication City/Country
    New York